
L&T Semiconductor Technologies (LTSCT) has entered a long-term collaboration with Hon Young Semiconductor (HYS), a subsidiary of Foxconn, to jointly develop high-voltage semiconductor wafers. This partnership aims to cater to growing demand in the automotive and industrial sectors by delivering wafers rated between 650 V and 3,300 V.
Scope of the Collaboration
- Voltage Range & Applications
The wafers under development will span the voltage spectrum of 650 V to 3,300 V, targeting applications in electric vehicles, power electronics, and industrial power systems. - Shared Expertise & Resources
LTSCT will leverage its domain knowledge in power systems and integration, while HYS brings in its advanced wafer fabrication capabilities. The collaboration intends to jointly address performance, quality, and scalability challenges. - Access to Taiwan Fabs
The deal gives L&T access to HYS’s manufacturing facilities in Taiwan, allowing engineering, prototyping, and production of wafers tailored for high-voltage power components.
Strategic Rationale & Backdrop
- Strengthening Power Semiconductor Portfolio
This collaboration builds upon L&T Semiconductor’s recent moves into power hardware. Earlier, the company acquired the power modules business of Fujitsu General Electronics in a deal worth ₹118.32 crore. - Growing Demand in EVs & Industrial Electrification
As more electric vehicles and industrial systems demand efficient, high-voltage components, indigenous wafer development becomes critical. The 650 V to 3,300 V range is especially valuable for traction inverters, converters, and grid systems. - Global Semiconductor Strategy
For Foxconn and its arms, expanding into power semiconductor wafers strengthens their positioning in the global electronics supply chain. The partnership is aligned with broader ambitions in the semiconductor and manufacturing sectors.
Challenges & Key Success Factors:
- Achieving High Yields
Producing high-voltage wafers with consistent yield and quality is technically demanding. Scaling from prototype to mass production will test the joint team’s capabilities. - Automotive & Industry Qualification
Wafers used in automotive or heavy industrial settings must meet strict reliability and certification standards. - Cost Competitiveness
To make the offering viable, production costs must be controlled while maintaining quality, especially against global competitors. - Localization & Ecosystem Integration
While leveraging Taiwan fabs offers speed and maturity, long-term success may require building local capabilities in India for testing, packaging, and downstream integration.

